<?xml version="1.0" encoding="UTF-8"?><rss xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:content="http://purl.org/rss/1.0/modules/content/" xmlns:atom="http://www.w3.org/2005/Atom" version="2.0"><channel><title><![CDATA[Reliability Engineering]]></title><description><![CDATA[Reliability Engineering]]></description><link>https://reliabilityengineering.hashnode.dev</link><generator>RSS for Node</generator><lastBuildDate>Thu, 12 Nov 2026 07:45:35 GMT</lastBuildDate><atom:link href="https://reliabilityengineering.hashnode.dev/rss.xml" rel="self" type="application/rss+xml"/><language><![CDATA[en]]></language><ttl>60</ttl><item><title><![CDATA[Five Technical Inputs You Need Before Planning Electronic Hardware Qualification]]></title><description><![CDATA[Learn why passing standard qualification tests does not always prove an electronic component is suitable for real-world use.]]></description><link>https://reliabilityengineering.hashnode.dev/five-technical-inputs-you-need-before-planning-electronic-hardware-qualification</link><guid isPermaLink="true">https://reliabilityengineering.hashnode.dev/five-technical-inputs-you-need-before-planning-electronic-hardware-qualification</guid><category><![CDATA[Site Reliability Engineering]]></category><category><![CDATA[ReliabilityEngineering]]></category><category><![CDATA[reliability of science]]></category><category><![CDATA[Reliability testing]]></category><dc:creator><![CDATA[James Doran]]></dc:creator><pubDate>Fri, 06 Nov 2026 14:35:46 GMT</pubDate><enclosure url="https://cdn.hashnode.com/uploads/covers/6aeb07542506f068d1441571/975c1e9b-ae7e-4bf6-8e38-d026d083379d.jpg" length="0" type="image/jpeg"/><content:encoded><![CDATA[<p>When developing a new electronic product, engineers often focus first on the available test equipment and applicable standards.</p>
<p>A more effective approach is to establish what needs to be demonstrated before deciding how to test it.</p>
<p>Here are five inputs that can significantly improve the development of a hardware qualification plan.</p>
<h2>1. Operating Profile</h2>
<p>Document the expected electrical, thermal and environmental conditions.</p>
<p>Consider normal operation, startup, shutdown, storage and relevant transient events.</p>
<h2>2. Hardware Configuration</h2>
<p>Qualification evidence should correspond to identifiable hardware.</p>
<p>Important details may include PCB revision, semiconductor part numbers, package variants, assembly materials and firmware configuration.</p>
<p>Changes to these features can affect the applicability of earlier test results.</p>
<h2>3. Potential Failure Mechanisms</h2>
<p>Identify credible mechanisms associated with the hardware technology and operating conditions.</p>
<p>Examples include solder fatigue, wire-bond degradation, moisture-related corrosion and semiconductor parameter drift.</p>
<p>The applicable mechanisms depend on the actual construction and environment.</p>
<h2>4. Existing Qualification Evidence</h2>
<p>Review component datasheets, manufacturer reliability reports and previous development tests.</p>
<p>Determine which requirements are already supported and which need further assessment.</p>
<h2>5. Acceptance Criteria</h2>
<p>Define what constitutes a failure before testing begins.</p>
<p>This may include electrical parameter limits, functional behaviour, physical damage or specified performance degradation.</p>
<p>Clear criteria support consistent interpretation and reduce ambiguity when anomalies occur.</p>
<h2>Bringing the Inputs Together</h2>
<p>A useful qualification programme connects these inputs with appropriate test methods, sample plans and engineering analysis.</p>
<p>For hardware teams developing systems for demanding environments, <a href="https://spacerel.com/capabilities/qualification/">SPACEREL's component and system qualification approach</a> provides further context on qualification strategy, environmental testing and component engineering.</p>
<p>The central principle is simple: define the technical question first, then select the evidence needed to answer it.</p>
]]></content:encoded></item><item><title><![CDATA[The Weakest Link in High-Temperature Electronics May Not Be the Semiconductor]]></title><description><![CDATA[Consider an electronic assembly designed to operate for several years in a high-temperature environment. The semiconductor may satisfy its electrical…]]></description><link>https://reliabilityengineering.hashnode.dev/the-weakest-link-in-high-temperature-electronics-may-not-be-the-semiconductor</link><guid isPermaLink="true">https://reliabilityengineering.hashnode.dev/the-weakest-link-in-high-temperature-electronics-may-not-be-the-semiconductor</guid><dc:creator><![CDATA[James Doran]]></dc:creator><pubDate>Wed, 04 Nov 2026 10:25:45 GMT</pubDate><content:encoded><![CDATA[<p>Consider an electronic assembly designed to operate for several years in a high-temperature environment.</p>
<p>The semiconductor may satisfy its electrical performance requirements, but what happens to the materials surrounding it?</p>
<p>Electronic packaging introduces interfaces between materials with different thermal, mechanical and chemical properties.</p>
<p>Die attach materials, wire bonds, solder joints, substrates and encapsulants can become limiting factors as operating temperatures and exposure durations increase.</p>
<p>For example, elevated temperatures may accelerate intermetallic growth at bonded interfaces. Some polymeric materials may experience chemical ageing or changes in their mechanical properties. Repeated heating and cooling can also create cyclic stresses due to differences in thermal expansion.</p>
<p>These mechanisms do not affect every assembly equally. Their significance depends on material selection, manufacturing processes, temperature profiles and the required service life.</p>
<p>This is why high-temperature reliability should be considered at component, package and assembly levels rather than treated solely as a semiconductor specification.</p>
<p>A technical discussion of these engineering considerations is available in this article on high-temperature, high-reliability electronics:</p>
<p><a href="https://spacerel.com/resources/high-temperature-high-reliability-electronics/">https://spacerel.com/resources/high-temperature-high-reliability-electronics/</a></p>
<p>Additional engineering resources can be explored through the SPACEREL website:</p>
<p><a href="https://spacerel.com/">https://spacerel.com/</a></p>
<p>#SemiconductorPackaging #HighTemperatureElectronics #WireBonding #FailureAnalysis #ReliabilityEngineering</p>
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